简化的数值建模和分析夹层混凝土使用SAP2000绝缘板

结构和土木工程国际会议上的研究

2019年6月07日|巴黎,法国

同上赛义德阿迪尔

CECOS大学信息技术和新兴科学,巴基斯坦

海报和接受抽象:飞机

文摘

夹层混凝土绝缘面板(SCIP)技术自1960年以来一直在使用。其早期应用包括航空航天应用、冰箱等,如今被广泛应用于建筑施工。但这种技术的主要问题是没有这个技术分析和设计指南。这种技术也缺乏适当的分析和设计策略。软件如ANSYS有限元分析等不更用户友好的典型的分析和设计。研究人员使用这些软件,但他们没有解释正确的结果。因此,本文旨在发展SCIP技术分析和设计指导,使用商业软件SAP2000。在本研究的第一阶段,一个典型的SCIP小组一直在SAP2000建模负载应用根据“四点弯曲法”,然后分析。增量加载应用了从2.5 KN和位移对应于每个增量载荷都有记载。力和位移的图那么发达。 Finally, the graph obtained from SAP2000 results is then compared with experimental results of Mr Nouman (MS work). The SAP results show that the graph of SAP is straight and displacement values are near to zero. To match the results, loads are amplified with a constant value for SAP. For amplified load, the SAP result get matched to experimental result up to elastic limit, beyond this limit, there is difference between both results. This is due to the non linear properties of the material which are not defined in SAP2000. It is the limitation of this application SAP2000 make it non preferable software application for the analysis and design of sandwich panels for load at which material get crushed. In the end, we conclude that the buildings having SCIP technology can be modelled and analyzed using SAP2000 up to their linearity limit.

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